A call for tutorials has been issued by the organisers of the SMT/HYBRID/PACKAGING 2005 show (19-21st April 2005). The organisers are particularly keen to receive abstracts about lead-free assembly or automotive applications, but also list a wide range of other topics for submissions:
– Vertical system integration on PCBs
– Packaging of electronic components
– Electronic assembly design
– Assembly of electronic components
– Electronic assembly interconnection technologies
– Electronic assembly process technologies
– Electronic assembly diagnostics and quality assurance
– Technical reliability of electronic assembly
– Advanced materials
– Sustainability
The deadline for submissions is 8th October 2004.