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SMT/HYBRID/PACKAGING 2005 call for tutorials

A call for tutorials has been issued by the organisers of the SMT/HYBRID/PACKAGING 2005 show (19-21st April 2005). The organisers are particularly keen to receive abstracts about lead-free assembly or automotive applications, but also list a wide range of other topics for submissions:

– Vertical system integration on PCBs

– Packaging of electronic components

– Electronic assembly design

– Assembly of electronic components

– Electronic assembly interconnection technologies

– Electronic assembly process technologies

– Electronic assembly diagnostics and quality assurance

– Technical reliability of electronic assembly

– Advanced materials

– Sustainability

The deadline for submissions is 8th October 2004.

Author

  • In 2001 Mike acquired Napier with Suzy Kenyon. Since that time he has directed major PR and marketing programmes for a wide range of technology clients. He is actively involved in developing the PR and marketing industries, and is Chair of the PRCA B2B Group, and lectures in PR at Southampton Solent University. Mike offers a unique blend of technical and marketing expertise, and was awarded a Masters Degree in Electronic and Electrical Engineering from the University of Surrey and an MBA from Kingston University.

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